c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . h i g h s e n s i t i v i t y h a l l e f f e c t s e n s o r i c w i t h f g o u t p u t t h e a p x 9 1 4 5 i s a n i n t e g r a t e d h a l l e f f e c t s e n s o r i c w i t h f r e q u e n c y g e n e r a t i o n o u t p u t f o r e l e c t r i c c o m m u t a t i o n o f d c b r u s h l e s s m o t o r a p p l i c a t i o n s . t h e a p x 9 1 4 5 i s a v a i l a b l e i n a l o w c o s t t o - 9 2 m 4 p a c k a g e . p i n o u t s o r d e r i n g a n d m a r k i n g i n f o r m a t i o n f e a t u r e s g e n e r a l d e s c r i p t i o n a p p l i c a t i o n s b r u s h l e s s d c f a n o n - c h i p h a l l s e n s o r b u i l d - i n o u t p u t z e n e r d i o d e s t o c l a m p t h e p e a k o u t p u t v o l t a g e b u i l d - i n f r e q u e n c y g e n e r a t i o n o u t p u t h i g h o u t p u t s i n k i n g c a p a b i l i t y u p t o 4 0 0 m a h i g h s e n s i t i v i l t y h a l l e f f e c t s e n s e r i c : 6 5 g 4 p i n t o - 9 2 m p a c k a g e l e a d f r e e a v a i l a b l e ( r o h s c o m p l i a n t ) apx9145 package code e : to - 92m4 operating ambient temp. range e : - 20 to 70 c handling code pb : plastic bag tb : tape & box tr : tape & reel lead free code l : lead free device blank : original device apx9145 e : apx 9145 xxxxx xxxxx - date code handling code temp. range package code lead free code apx9145 1 : fg 2 3 2 : do 1 3 : dob 4 4 : gnd f r o n t v i e w n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s a n d c o m p a t i b l e w i t h b o t h s n p b a n d l e a d - f r e e s o l d i e r i n g o p e r a t i o n s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j s t d - 0 2 0 c f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 2 symbol parameter rating unit v cc supply voltage ( do/dob voltage ) 25 v v off fg pin off voltage 25 v i fg fg sink current 10 ma i out output current 5 00 ma p d maximum power dissipation 500 mw t j j unction temperature range - 20 to 150 t stg storage tem perature range - 65 to 150 t sol soldering temperature (10 sec.) 260 c a b s o l u t e m a x i m u m r a t i n g s ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) b l o c k d i a g r a m p i n d e s c r i p t i o n gnd do apx9145 voltage regulator hall element temperature compensated current amplifier latch circuit output buffer 1 hysteresis control sensitivity control fg output buffer 2 dob zener diodes zener diodes rotation frequency detection pin no. name description 1 fg open collector pin for rotation frequency detection 2 do coil output / power input 3 dob coil output / power input 4 gnd ic ground note 1: stresses beyond the absolute maximum rating may damage the devic e and operating in the absolute maximum rating conditions may affect device reliability. note 2: the maximum allowable power dissipation at any t a (ambient temperature) is calculated using: p d (max) = (t j ? t a ) / q ja ; t j = 125c. exceeding the maximum allowable power dissipation will result in excessive die temperature.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 3 apx9145 symbol parameter test condition min. typ. max. unit v sat output saturation voltage i out = 400ma 7 00 9 00 mv i cc supply current 11 15 ma i off fg off leakage current 1 m a v on fg on saturation voltage i fg = 5ma 0.2 0. 4 v v clamp clamp o utput voltage 33 v t r output rise time r l = 200 w, c l = 10pf 0.4 m s t f output fall time r l = 200 w, c l = 10pf 0.1 m s t d propagation delay time r l = 200 w, c l = 10pf 2 m s e l e c t r i c a l c h a r a c t e r i s t i c s ( t a = 2 5 c , v c c = 1 2 v u n l e s s o t h e r w i s e n o t e d ) m a g n e t i c c h a r a c t e r i s t i c s ( t a = 2 5 c , v c c = 1 2 v u n l e s s o t h e r w i s e n o t e d ) apx9145 symbol parameter test condition min. typ. max. unit bop magnetic operate points 10 65 gauss brp magnetic release points - 65 - 10 gauss symbol parameter rating unit v cc supply voltage (do/dob voltage) 3. 7 to 20 v i out maximum output sink current 400 ma i fg maximum fg sink current 5 ma v off maximum fg pin off voltage 20 v t j operating ambient temperature - 20 to 70 c t a junction tempe rature range - 20 to 125 c r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s ( t a = 2 5 c )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 4 a p p l i c a t i o n c i r c u i t t y p i c a l d c b r u s h l e s s f a n a p p l i c a t i o n c i r c u i t 2 3 1 v dd +b -b apx9145 l1 l2 4 v fg t e s t c i r c u i t +b -b v1 v cc i cc v2 v a a v i fg i off v on note 1: measure v cc , i cc when do is off. note 2: measure v on , i fg when fg is on. note 3: measure i off when fg is off.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 5 9 9.5 10 10.5 11 11.5 12 -20 0 20 40 60 80 100 120 140 0 2 4 6 8 10 12 0 5 10 15 20 25 t y p i c a l c h a r a c t e r i s t i c s ( t a = 2 5 c , v c c = 1 2 v u n l e s s o t h e r w i s e n o t e d ) s u p p l y c u r r e n t v s . s u p p l y v o l t a g e s u p p l y v o l t a g e ( v ) supply current (ma) s u p p l y c u r r e n t v s . t e m p e r a t u r e t e m p e r a t u r e ( c ) supply current (ma) -60 -45 -30 -15 0 15 30 45 60 -20 0 20 40 60 80 100 120 140 -60 -45 -30 -15 0 15 30 45 60 3 7 11 15 19 23 m a g n e t i c s w i t c h i n g p o i n t s v s . s u p p l y v o l t a g e magnetic switching points (g) s u p p l y v o l t a g e ( v ) magnetic switching points (g) m a g n e t i c s w i t c h i n g p o i n t s v s . t e m p e r a t u r e t e m p e r a t u r e ( c )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 6 0 100 200 300 400 500 600 0 25 50 75 100 125 0 1 2 3 4 5 0.1 0.15 0.2 0.25 50 100 150 200 250 300 350 400 0 0.15 0.3 0.45 0.6 0.75 t y p i c a l c h a r a c t e r i s t i c s ( c o n t . ) o u t p u t c u r r e n t v s . o u t p u t s a t u r a t i o n v o l t a g e o u t p u t s a t u r a t i o n v o l t a g e ( v ) output current (ma) f g s i n k c u r r e n t v s f g o n s a t u r a t i o n v o l t a g e f g o n s a t u r a t i o n v o l t a g e ( v ) fg sink current (ma) p o w e r d i s s i p a t i o n v s . t e m p e r a t u r e power dissipation (mw) t e m p e r a t u r e ( c )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 7 p a c k a g e i n f o r m a t i o n t o - 9 2 m 4 a l1 j d b1 e1 e sensitive area (0.286 0.286mm2) position of hall sensor reference to the top-left of package x= 1.35 0.1mm y= 1.75 0.1mm 1.75mm 1.35mm s e l c ic chip marking surface millimeters inches dim min. max. min. max. a 3.60 3.70 0.141 0.145 b1 0.35 0.41 0.014 0.016 c 0.351 0.411 0.014 0.016 d 5.17 5.27 0.203 0.207 e 3.78 3.84 0.148 0.150 e1 1.24 1.30 0.049 0.051 e 1.50 1.60 0.059 0.063 j 4.04 4.34 0.158 0.170 l 14.0 15.0 0.549 0.588 l1 1.342 1.542 0.053 0.060 s 0.45 0.55 0.018 0.022
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 8 t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 temperature time critical zone t l to t p p h y s i c a l s p e c i f i c a t i o n s terminal material solder - plated copper (solder material : 90/10 or 63/37 snpb) , 100%sn lead solderability meets eia specification rsi86 - 91, ansi/j - std - 002 category 3. r e f l o w c o n d i t i o n ( i r / c o n v e c t i o n o r v p r r e f l o w ) c l a s s i f i c a t i n r e f l o w p r o f i l e s profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat - temperature min (tsmin) - temperature max (tsmax) - time (min to max) (ts) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (t l ) - time (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak /classificatioon temperature (tp) see table 1 see table 2 time within 5 c of actual peak temperature (tp) 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/se cond max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. notes: all temperatures refer to topside of the package .measured on the body surface.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 9 reliability test program test item method description solderability mil-std-883d-2003 245 c , 5 sec holt mil-std-883d-1005.7 1000 hrs bias @ 125 c pct jesd-22-b, a102 168 hrs, 100 % rh , 121 c tst mil-std-883d-1011.9 -65 c ~ 150 c , 200 cycles esd mil-std-883d-3015.7 vhbm > 2kv, vmm > 200v latch-up jesd 78 10ms , i tr > 100ma c a r r i e r t a p e & r e e l d i m e n s i o n s t ao e w po p ko bo d1 d f p1 table 2. pb - free process ? package classification reflow temperatures package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 +0 c* 260 +0 c* 260 +0 c* 1.6 mm ? 2.5 mm 260 +0 c* 250 +0 c* 245 +0 c* 3 2.5 mm 250 +0 c* 245 +0 c* 245 +0 c* *tolerance: the device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means peak reflow temperature +0 c. for example 260 c+0 c) at the rated msl level. table 1. snpb entectic process ? package peak reflow temperature s package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 240 +0/ - 5 c 225 +0/ - 5 c 3 2.5 mm 225 +0/ - 5 c 225 +0/ - 5 c c l a s s i f i c a t i n r e f l o w p r o f i l e s ( c o n t . )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - n o v . , 2 0 0 5 a p x 9 1 4 5 w w w . a n p e c . c o m . t w 1 0 a j b t2 t1 c application a0 a1 a2 a3 b0 b1 b2 c0 c1 3.18~12 901 761 301 901 311 761 5.8 3.8 c2 d d1 d2 f1=f2 f1 - f2 m h h1 7.8 4.00.2 0.36~0.53 9.0 max 2.5+0.2 - 0.1 0.3 2.50.5 160.5 90.5 h2 h2a h3 h4 h5=h0+m l l1 p p1 0.5 max 0.5 max 27.0 max 20.0 max 18.50.5 11.0 max 2.5 min 12.70.3 6.350.4 p2 t t1 t2 t3 t4 w w1 w2 to - 92 50.80.5 0.55 max 1.42 max 0.36~0.68 15 1.7 18.00.2 6.00.2 1 c a r r i e r t a p e & r e e l d i m e n s i o n s ( c o n t . ) ( m m ) c o v e r t a p e d i m e n s i o n s application carrier width cover tape width devices per reel to - 92 17.5~19 5.0~7.0 2000 (mm) c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 7 f , n o . 1 3 7 , l a n e 2 3 5 , p a c c h i a o r d . , h s i n t i e n c i t y , t a i p e i h s i e n , t a i w a n , r . o . c . t e l : 8 8 6 - 2 - 8 9 1 9 1 3 6 8 f a x : 8 8 6 - 2 - 8 9 1 9 1 3 6 9
|
